Solution Overview
Value
Solution Application

Single Pressure Sensing Solution for TWS Earbuds

This solution addresses the demand for slim-profile and highly reliable touch control in TWS and OWS earbuds. Integrated with the TS1603 pressure sensing chip, it offers multiple structural design options. By optimizing housing structure, pressing area geometry, silicone positioning and SMT mounting processes, the solution achieves high-precision force sensing under both side press and front press modes. It effectively enhances operation distinguishability and assembly consistency, fully meeting the consumer electronics industry’s requirements for miniaturized, low-power and high-sensitivity touch control.

Value

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Flexible Structural Adaptability

Compatible with various housing forms including clamshell and integrated tubular enclosures. It supports two pressing modes (side press and front press) to accommodate diverse body design requirements.

Precise & Stable Touch Performance

Recessed grooves are designed on the pressing area to improve recognition. The silicone layer features a thickness ≥ 0.6 mm and hardness ranging from 30A to 65A, delivering comfortable tactile feel and stable response.

Efficient & Consistent Integration

The pressure sensing component can be directly mounted onto PCBs or FPCs via SMT and supports automated placement. The silicone positioning structure improves assembly consistency and reduces risks of yield fluctuation.

Solution Application

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